Course Details
Contents
Module I: III-V alloy engineering, heterojunction band alignment, strain, quantum well physics, and optical confinement.
Module II: Optical gain, LED, laser, modulator, and photodetector DC operation, plus device characterisation techniques.
Module III: Laser rate equations, small-signal modulation, bandwidth analysis for modulators and photodetectors, large-signal transient simulation, and chirp propagation.
Module IV: Photonic integration, coherent transceivers, SOAs, and AI optical interconnect architectures, including co-packaged optics and the 800G–1.6T–3.2T transceiver roadmap.