Microelectronics and VLSI

Works at the intersection of signal processing algorithms and VLSI architectures, with emphasis on low-power design for resource-constrained systems, digital arithmetic, machine-learning hardware, and edge computing. Applications include chip design for remote health monitoring — cardiovascular disease, diabetes, and neurological and developmental disorders — hardware-software co-design for accelerating cancer diagnostics, real-time battery health monitoring for electric vehicles, hardware security, and design for testability and reliability.

Works on semiconductor device physics and computational nanoelectronics, developing physical models for nanoscale transistors and building TCAD tools for device modelling and simulation. Work spans multiscale modelling and in-house simulation frameworks, extending to machine-learning approaches for fast device electrostatics.

Leads work on the physics and engineering of nanodevices, exploring next-generation classical, neuromorphic, and quantum low-power devices. Research covers steep-slope transistors built from ultrathin van der Waals heterostructures, twisted 2D heterostructures, and ferroelectric gating of 2D semiconductors, combining cleanroom fabrication, electrical characterisation, and modelling.

Leads the Nanophotonics Lab, working at the intersection of photonics, semiconductor devices, and nanotechnology. Research spans dielectric nanophotonics and metasurfaces, plasmonics, silicon photonics, mid-infrared devices, and integrated optical sensors, with current emphasis on photonic integrated circuits for high-speed optical communication and quantum key distribution.

Leads multidisciplinary work on heterogeneous integration for sensors and systems, spanning MEMS and NEMS, 3D IC integration, lab-on-chip platforms, and nano-bio and gas sensors. Applications include point-of-care diagnostic devices, notably an electronic RNA-based test kit developed for COVID-19 detection.

Works on VLSI technology and semiconductor device physics alongside biosensors and lab-on-chip platforms, drawing on fabrication and electrochemistry. Research includes 3D IC integration and heterogeneous packaging — high-density metal-alloy interconnects and low-temperature Cu-Cu wafer bonding — and low-cost, ultrasensitive nanobiosensor platforms based on electrospun nanofibers, together with MEMS.

Works on electron device physics, mesoscopic electronics, and carrier transport phenomena in semiconductor devices, including behaviour under extreme conditions such as cryogenic operation. Work combines numerical simulation and calibrated TCAD modelling — for example hydrodynamic transport models for SiGe heterojunction bipolar transistors — to build accurate computational descriptions of device behaviour.

Works on nanomaterials-based flexible and wearable electronics, low-cost eco-friendly paper-based electronics, and multifunctional nanocomposites for bioanalytical and energy applications. Research spans chemical and biosensors, nanoelectronics, applied electrochemistry, and microfabrication, including self-powered piezoelectric pressure sensors for wearable human-machine interfaces and nanostructured gas sensors.

Works on analog, digital, and mixed-signal IC design for imaging systems, focusing on CMOS image sensors, 2D/3D vision sensors, event-based cameras, and direct time-of-flight LiDAR. Emphasis is on low-noise, high-dynamic-range, high-speed, and low-power imaging architectures and in-sensor computing, including compressive LiDAR pixels based on single-photon avalanche diodes, for autonomous and space applications.

Works on nanoscale objects and phenomena for sensing applications, spanning bionanosensors, nanofluidics and large-scale microfluidics, nanocarbons such as graphene and carbon nanotubes, 2D materials, and composites, with emphasis on bio-chemical sensing.

Works on analog and mixed-signal circuit design for ultra-low-power systems, including data converters, high-speed analog and mixed-signal circuits, ambient energy harvesting, and power-management circuits aimed at sustainable next-generation IoT nodes, informed by industry experience in analog design for mobile handsets.

Works on analog and radio-frequency integrated circuit design with emphasis on low-power and energy-efficient architectures, alongside interests in integrated optical RFICs and semiconductor devices.

Works on analog, digital, and mixed-signal IC design for imaging systems, focusing on CMOS image sensors, 2D/3D vision sensors, event-based cameras, and direct time-of-flight LiDAR. Emphasis is on low-noise, high-dynamic-range, high-speed, and low-power imaging architectures and in-sensor computing, including compressive LiDAR pixels based on single-photon avalanche diodes, for autonomous and space applications.

Works on analog and radio-frequency integrated circuit design, with emphasis on circuit techniques for full-duplex wireless communication — including self-interference cancellation in the analog baseband — alongside broader analog and RF front-end design.

Works on analog, RF, mmWave, and mixed-signal circuit and system design, covering integrated front-ends and system architectures for high-frequency wireless applications.

Works on fiber-optic communication and photonics, including nonlinear fiber optics, semiconductor optical amplifiers, and parametric and phase-sensitive amplification. Related interests span optical phase conjugation for mitigating dispersion and Kerr nonlinearity in long-haul transmission, all-optical signal processing, photonic computing, and silicon-photonic coherent receivers.

Works on CMOS analog and mixed-signal circuit design, sensors and sensor interfaces, and power management, with emphasis on robust, fault-tolerant designs including high-voltage CMOS gate drivers and precision optical sensor interfaces, bringing an industry perspective from analog mixed-signal R&D and semiconductor product development.